Cover of Electronics manufacturing

Mark as

Electronics manufacturing

by John H. Lau

Buy this book
Add to a list
Review

See on goodreads

More by John H. Lau

Chip scale package (CSP)

by Ricky S.W. Lee

Cover of Chip scale package (CSP)
Review
Buy this book More books like Chip scale package (CSP)

Electronic packaging

by C.P. Wong

Cover of Electronic packaging
Review
Buy this book More books like Electronic packaging

The Mechanics of solder alloy interconnects

by Darrel R. Frear

Cover of The Mechanics of solder alloy interconnects
Review
Buy this book More books like The Mechanics of solder alloy interconnects

Electrical Conductive Adhesives with Nanotechnologies

by C.P. Wong

Cover of Electrical Conductive Adhesives with Nanotechnologies
Review
Buy this book More books like Electrical Conductive Adhesives with Nanotechnologies

Electronic packaging

by C.P. Wong

Cover of Electronic packaging
Review
Buy this book More books like Electronic packaging

Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging

by C.P. Wong

Cover of Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging
Review
Buy this book More books like Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging

Chip scale package (CSP)

by Ricky S.W. Lee

Cover of Chip scale package (CSP)
Review
Buy this book More books like Chip scale package (CSP)

Recent activity

Rate this book to see your activity here.

Comments and reviews

Please sign in to leave a comment