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Application of fracture mechanics in electronic packaging

William T. Chen, D. T. Read

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3 Books Similar to Application of fracture mechanics in electronic packaging by William T. Chen

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Advances in Electronic Packaging 1992 by William T. Chen

Cover of Advances in Electronic Packaging 1992
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Manufacturing aspects in electronic packaging 1993 by Yung-Cheng Lee

Cover of Manufacturing aspects in electronic packaging 1993
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Manufacturing challenges in electronic packaging by Yung-Cheng Lee

Cover of Manufacturing challenges in electronic packaging
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