Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Evans, John W., Abhijit Dasgupta, Jillian Y. Evans, Michael Pecht

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests. This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics. It does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need...

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