Home > Authors > John M. Considine > Proceedings, sixth international symposium

Proceedings, sixth international symposium

John M. Considine, Sally A. Ralph

The USDA Forest Products Laboratory sponsored the 6th International Symposium: Moisture and Creep Effects on Paper, Board and Containers at the Monona Terrace Convention Center, Madison, WI, USA on 14-15 July 2009. Attendees heard 20 technical presentations; presenters were from seven different countries and three continents. Session topics included Corrugated Performance, Moisture Flow, Component Behavior, Industry Efforts, Other Materials, Moisture and Creep Response.

Recent activity

Rate this book to see your activity here.

1 Book Similar to Proceedings, sixth international symposium by John M. Considine

Bookscovery readers who liked Proceedings, sixth international symposium also like Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8. How many of these have you read?